- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 294
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
728
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
728
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
56
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
56
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT 1300/RL
|
- | - | Shield Finger | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT 1300/RL
|
- | - | Shield Finger | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT 1300/RL
|
- | - | Shield Finger | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Flash | Solder | ||
|
|
TE Connectivity AMP Connectors |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PRE-LOADED SPRING FINGER 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.071" (1.80mm) | 0.128" (3.26mm) | 0.045" (1.15mm) | 19.69μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
11,475
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PRE-LOADED SPRING FINGER 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.071" (1.80mm) | 0.128" (3.26mm) | 0.045" (1.15mm) | 19.69μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
11,475
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PRE-LOADED SPRING FINGER 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.071" (1.80mm) | 0.128" (3.26mm) | 0.045" (1.15mm) | 19.69μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
120,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
- | - | Shield Finger，Pre-Loaded | - | 0.041" (1.05mm) | - | 0.047" (1.20mm) | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
128,582
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
- | - | Shield Finger，Pre-Loaded | - | 0.041" (1.05mm) | - | 0.047" (1.20mm) | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
128,582
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
- | - | Shield Finger，Pre-Loaded | - | 0.041" (1.05mm) | - | 0.047" (1.20mm) | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1312ATYPE
|
- | - | Shield Finger | Copper Alloy | 0.051" (1.30mm) | 0.177" (4.50mm) | 0.047" (1.20mm) | 2μin (0.05μm) | Solder |
