- Series：
-
- Operating Temperature：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Electus conditionibus;
Odonata Lepidoptera products 962
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
25,564
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X4.27MM
|
Slot Mount | 121°C | Fingerstock | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Wurth Electronics Inc. |
2,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
2,273
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 2.03X9.53MM
|
- | 121°C | Fingerstock | 0.062" (1.57mm) | 0.375" (9.53mm) | 0.084" (2.13mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
830
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 8.1X609.6MM
|
No Snag | 121°C | Fingerstock | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
114
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.40MM
|
No Snag | 121°C | Fingerstock | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
205
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK BECU ALY 5.33X609.6MM
|
- | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
219
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X406.4MM
|
No Snag | 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
359
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 27.94X609.6MM
|
No Snag | 121°C | Fingerstock | 0.400" (10.16mm) | 24.000" (609.60mm) | 1.100" (27.94mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
447
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 15.24X609.6MM
|
No Snag | 121°C | Fingerstock | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
527
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 11.43X406.4MM
|
- | 121°C | Fingerstock | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
128
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 11.43X411.48MM
|
- | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU ALLOY 6X609.6MM
|
Twist | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
159
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
|
Twist | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
491
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
102
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive |
