- Series：
-
- Operating Temperature：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Electus conditionibus;
Odonata Lepidoptera products 962
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
2,055
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X18.54MM
|
Slot Mount | 121°C | Fingerstock | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
|
Wurth Electronics Inc. |
600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTCK BECU ALY 7.57X406.4MM
|
- | 121°C | Fingerstock | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
85
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.4MM
|
No Snag | 121°C | Fingerstock | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
55
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X609.6MM
|
No Snag | 121°C | Fingerstock | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 2.79X609.6MM
|
Twist | 121°C | Fingerstock | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
79
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | - | Adhesive |
