- Material：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
1,848
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VRT MT BLK 1.5"
|
637 | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.375" (34.93mm) | Bolt On and PC Pin | 0.500" (12.70mm) | 6.0W @ 65°C | - | Black Anodized | ||
|
|
|
CUI Inc. |
1,950
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | - | 0.450" (11.43mm) | 3.8W @ 75°C | 21.90°C/W | Tin | ||
|
|
|
CUI Inc. |
2,094
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | - | 0.450" (11.43mm) | 3.8W @ 75°C | 21.90°C/W | Tin | ||
|
|
|
CUI Inc. |
2,094
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
- | Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | - | 0.450" (11.43mm) | 3.8W @ 75°C | 21.90°C/W | Tin | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT MT BLK 1.5"
|
637 | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 1.375" (34.93mm) | Bolt On and PC Pin | 0.500" (12.70mm) | 6.0W @ 65°C | 10.80°C/W | Black Anodized |
