- Type:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Electus conditionibus;
Odonata Lepidoptera products 4
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
11,699
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||||
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 14.
|
Top Mount | - | TO-263 (D2Pak) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||||
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.9X15X9.5MM
|
Board Level | SMD Pad | TO-263 (D2Pak) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - |