manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Odonata Lepidoptera products 4
Image part manufacturer quantitas partus tempus Unit Price buy Description Type Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
7106DG
Aavid, Thermal Division of Boyd Corporation
11,699
III dies
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEATSINK .375" D2PAK
Top Mount SMD Pad TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 2.0W @ 40°C 5.00°C/W @ 400 LFM -
HSS-C2591-SMT-TR
CUI Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEAT SINK, STAMPING, TO-263, 14.
Top Mount - TO-263 (D2Pak) 2.1W @ 75°C 8.15°C/W @ 200 LFM 35.71°C/W
7106D/TRG
Aavid, Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEATSINK .375" D2PAK
Top Mount SMD Pad TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 2.0W @ 40°C 5.00°C/W @ 400 LFM -
833900T00000
Comair Rotron
Quaestiones
-
-
MOQ: 1  MPQ: 1
HEATSINK STAMP 25.9X15X9.5MM
Board Level SMD Pad TO-263 (D2Pak) 2.0W @ 40°C 5.00°C/W @ 400 LFM -