- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Electus conditionibus;
Odonata Lepidoptera products 3
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Advanced Thermal Solutions Inc. |
49
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X70X15MM
|
Top Mount | 11.800" (299.72mm) | Adhesive | - | 0.590" (15.00mm) | 2.40°C/W @ 200 LFM | 18.20°C/W | Degreased | ||
|
|
|
Delta Electronics |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY LGA2011 NARROW
|
Board Level | 4.173" (106.00mm) | Bolt On | LGA | 1.004" (25.50mm) | - | 0.26°C/W | - | ||
|
|
|
ASSMANN WSW Components |
96
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Board Level | 0.591" (15.01mm) | Bolt On | TO-220, TOP-3 | 0.984" (25.00mm) | - | 5.00°C/W | Black Anodized |
