- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Electus conditionibus;
Odonata Lepidoptera products 6
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
9,699
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D-PAK
|
0.900" (22.86mm) | SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
0.900" (22.86mm) | SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,764
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
0.900" (22.86mm) | SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
938
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-252 D-PAK COPPER
|
0.842" (21.40mm) | - | - | 21.00°C/W @ 200 LFM | 28.00°C/W | |||
|
|
|
CUI Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-252, 8 X
|
0.900" (22.86mm) | - | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | ||
|
|
|
Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 22.9X8X10.2MM
|
0.900" (22.86mm) | SMD Pad | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - |
