- Usage：
-
- Outline：
-
- Electus conditionibus;
Odonata Lepidoptera products 30
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Usage | Adhesive | Outline | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Usage | Adhesive | Outline | |
|
|
|
t-Global Technology |
4,175
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 10X50X0.12MM
|
- | - | 50.00mm x 10.00mm | ||
|
|
|
t-Global Technology |
3,108
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 TO-220 0.12MM
|
TO-220 | - | 18.03mm x 12.70mm | ||
|
|
|
t-Global Technology |
1,241
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-220 0.12MM W/ADH
|
TO-220 | Adhesive - Both Sides | 19.05mm x 10.41mm | ||
|
|
|
t-Global Technology |
200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 24X21.01X0.12MM
|
- | - | 24.00mm x 21.01mm | ||
|
|
|
t-Global Technology |
648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 TO-220 0.12MM
|
TO-220 | - | 19.05mm x 10.41mm | ||
|
|
|
t-Global Technology |
171
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 TO-220 0.12MM
|
TO-220 | - | 19.05mm x 12.70mm | ||
|
|
|
t-Global Technology |
135
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 TO-220 0.12MM
|
TO-220 | - | 19.05mm x 12.70mm | ||
|
|
|
t-Global Technology |
305
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 20X10X0.12MM
|
- | - | 20.00mm x 10.00mm | ||
|
|
|
t-Global Technology |
670
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-220 0.12MM W/ADH
|
TO-220 | Adhesive - Both Sides | 18.03mm x 12.70mm | ||
|
|
|
t-Global Technology |
185
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-220 0.12MM W/ADH
|
TO-220 | Adhesive - Both Sides | 21.84mm x 18.79mm | ||
|
|
|
t-Global Technology |
29
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TI900 POWER MOD 0.12MM W/ADH
|
Power Module | Adhesive - Both Sides | 63.50mm x 50.80mm | ||
|
|
|
t-Global Technology |
508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 TO-220 0.12MM
|
TO-220 | - | 19.05mm x 12.70mm | ||
|
|
|
t-Global Technology |
111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 SIP 0.12MM
|
SIP | - | 36.83mm x 21.29mm | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-220 0.12MM W/ADH
|
TO-220 | Adhesive - Both Sides | 19.05mm x 12.70mm | ||
|
|
|
t-Global Technology |
95
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 TO-220 0.12MM
|
TO-220 | - | 21.84mm x 18.79mm | ||
|
|
|
t-Global Technology |
4
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-220 0.12MM W/ADH
|
TO-220 | Adhesive - Both Sides | 17.45mm x 14.27mm | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 SIP 0.12MM W/ADH
|
SIP | Adhesive - Both Sides | 36.83mm x 21.29mm | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 19.5X12.7X0.12MM
|
- | - | 19.50mm x 12.70mm | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TI900 TO-220 0.12MM
|
TO-220 | - | 17.45mm x 14.27mm | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-220 0.12MM W/ADH
|
TO-220 | Adhesive - Both Sides | 19.05mm x 12.70mm |
