Odonata Lepidoptera products 53
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Material Height Length Width Plating Plating - Thickness Attachment Method
S1941-46R
Harwin Inc.
36,050
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Beryllium Copper 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1941-46R
Harwin Inc.
36,232
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Beryllium Copper 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1941-46R
Harwin Inc.
36,232
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Beryllium Copper 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1951-46R
Harwin Inc.
4,900
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Beryllium Copper 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1951-46R
Harwin Inc.
5,200
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Beryllium Copper 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1951-46R
Harwin Inc.
5,200
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Beryllium Copper 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1941-42R
Harwin Inc.
1,750
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER GOLD SMD
- - 0.285" (7.25mm) 0.378" (9.60mm) 0.225" (5.70mm) Gold Flash Solder
S1941-42R
Harwin Inc.
2,087
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER GOLD SMD
- - 0.285" (7.25mm) 0.378" (9.60mm) 0.225" (5.70mm) Gold Flash Solder
S1941-42R
Harwin Inc.
2,087
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER GOLD SMD
- - 0.285" (7.25mm) 0.378" (9.60mm) 0.225" (5.70mm) Gold Flash Solder
BMI-C-004
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
CONTACT BECU 6.0X4.3MM
- - - 0.235" (5.97mm) 0.235" (5.97mm) - - -
BMI-C-004
Laird Technologies EMI
1,511
III dies
-
MOQ: 1  MPQ: 1
CONTACT BECU 6.0X4.3MM
- - - 0.235" (5.97mm) 0.235" (5.97mm) - - -
BMI-C-004
Laird Technologies EMI
1,511
III dies
-
MOQ: 1  MPQ: 1
CONTACT BECU 6.0X4.3MM
- - - 0.235" (5.97mm) 0.235" (5.97mm) - - -
S9001-05R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT 1300/RL
- - 0.098" (2.50mm) 0.138" (3.50mm) 0.079" (2.00mm) Gold Flash Solder
S9001-05R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT 1300/RL
- - 0.098" (2.50mm) 0.138" (3.50mm) 0.079" (2.00mm) Gold Flash Solder
S9001-05R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT 1300/RL
- - 0.098" (2.50mm) 0.138" (3.50mm) 0.079" (2.00mm) Gold Flash Solder
S9001-46R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT TIN 1300
- - 0.098" (2.50mm) 0.138" (3.50mm) 0.079" (2.00mm) Tin Flash Solder
S9001-46R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT TIN 1300
- - 0.098" (2.50mm) 0.138" (3.50mm) 0.079" (2.00mm) Tin Flash Solder
S9001-46R
Harwin Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMT PRESSURE CONTACT TIN 1300
- - 0.098" (2.50mm) 0.138" (3.50mm) 0.079" (2.00mm) Tin Flash Solder
1447360-8
TE Connectivity AMP Connectors
10,000
III dies
-
MOQ: 1  MPQ: 1
SHIELDFINGER1312ATYPE
- Copper Alloy 0.051" (1.30mm) 0.177" (4.50mm) 0.047" (1.20mm) Gold 2μin (0.05μm) Solder
1447360-8
TE Connectivity AMP Connectors
15,748
III dies
-
MOQ: 1  MPQ: 1
SHIELDFINGER1312ATYPE
- Copper Alloy 0.051" (1.30mm) 0.177" (4.50mm) 0.047" (1.20mm) Gold 2μin (0.05μm) Solder