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- Electus conditionibus;
Odonata Lepidoptera products 2,625
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | ||
Wurth Electronics Inc. |
70
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam,Rayon Paper | D-Shape | 0.500" (12.70mm) | 39.370" (1.00m) | 0.500" (12.70mm) | - | Non-Conductive Adhesive | ||||
Laird Technologies EMI |
35
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 13X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | Adhesive | ||||
Wurth Electronics Inc. |
86
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam,Rayon Paper | Rectangle | 0.079" (2.00mm) | 39.370" (1.00m) | 1.181" (30.00mm) | - | Non-Conductive Adhesive | ||||
Wurth Electronics Inc. |
69
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | - | 39.370" (1.00m) | 0.315" (8.00mm) | - | - | ||||
Wurth Electronics Inc. |
27
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam,Rayon Paper | Square | 0.669" (17.00mm) | 39.370" (1.00m) | 0.669" (17.00mm) | - | Non-Conductive Adhesive | ||||
Laird Technologies EMI |
74
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | Rivet | ||||
Laird Technologies EMI |
94
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | - | - | - | - | - | 15.000" (381.00mm) | 0.623" (15.82mm) | - | - | ||||
Laird Technologies EMI |
63
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | Adhesive | ||||
Wurth Electronics Inc. |
10
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam,Rayon Paper | Rectangle | 0.079" (2.00mm) | 39.370" (1.00m) | 2.205" (56.00mm) | - | Non-Conductive Adhesive | ||||
Wurth Electronics Inc. |
6
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam,Rayon Paper | Rectangle | 0.079" (2.00mm) | 39.370" (1.00m) | 1.772" (45.00mm) | - | Non-Conductive Adhesive | ||||
Laird Technologies EMI |
71
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | Adhesive | ||||
Laird Technologies EMI |
22
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB LS-SERIES 1/8X24X24
|
ECCOSORB | - | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | ||||
Laird Technologies EMI |
14
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB LS-SERIES 1/4X24X24
|
ECCOSORB | - | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | ||||
Laird Technologies EMI |
25
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MF LOAD SERIES 1/4X12
|
ECCOSORB | - | Absorbing Sheet | - | Round | - | 12.000" (304.80mm) | 0.250" (6.35mm) | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | Solder | ||||
Laird Technologies EMI |
770
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | Solder | ||||
Laird Technologies EMI |
770
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | Solder | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder | ||||
Laird Technologies EMI |
350
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder | ||||
Laird Technologies EMI |
350
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder |