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- Electus conditionibus;
Odonata Lepidoptera products 2,625
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
260
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.118" (3.00mm) | 39.370" (1.00m) | 0.354" (9.00mm) | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.276" (7.00mm) | 39.370" (1.00m) | 0.394" (10.00mm) | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
101
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.26X406.4MM
|
Dual Slot | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.325" (8.26mm) | - | Slot | ||
|
|
|
Laird Technologies EMI |
1,700
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.210" (5.33mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | Clip | ||
|
|
|
Wurth Electronics Inc. |
102
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.079" (2.00mm) | 39.370" (1.00m) | 0.512" (13.00mm) | - | Non-Conductive Adhesive | ||
|
|
|
Leader Tech Inc. |
116
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FSG，.060"H X .125"W X 48"L
|
- | - | Fabric Over Foam | - | D-Shape | 0.060" (1.52mm) | 48.000" (121.90cm) | 0.125" (3.18mm) | - | - | ||
|
|
|
Leader Tech Inc. |
220
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FSG，.015"H X .200"W X 48"L
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.015" (0.38mm) | 48.000" (121.92cm) | 0.200" (5.08mm) | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
541
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTCK BECU ALY 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | Slot | ||
|
|
|
Laird Technologies EMI |
3,784
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.1X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | Slot | ||
|
|
|
Laird Technologies EMI |
134
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
192
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | - | Clip | ||
|
|
|
Laird Technologies EMI |
184
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.297" (7.54mm) | - | Clip | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.059" (1.50mm) | 39.370" (1.00m) | 0.984" (25.00mm) | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.118" (3.00mm) | 39.370" (1.00m) | 0.906" (23.00mm) | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
1,428
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | - | - | 12.000" (304.80mm) | 0.063" (1.60mm) | - | - | ||
|
|
|
Laird Technologies EMI |
104
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.4X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.350" (8.89mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | - | Clip | ||
|
|
|
Leader Tech Inc. |
139
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FSG，.25"H X .375"W X 48"L
|
- | - | Fabric Over Foam | - | D-Shape | 0.250" (6.35mm) | 48.000" (121.90cm) | 0.375" (9.52mm) | - | - | ||
|
|
|
Laird Technologies EMI |
405
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.375" (9.53mm) | 0.940" (23.88mm) | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
259
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
143
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | - | Clip |
