- Series：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Electus conditionibus;
Odonata Lepidoptera products 10
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,250
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ohmite |
1,763
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268 BLACK
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | ||
|
|
|
Apex Microtechnology |
31
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT
|
Apex Precision Power | Top Mount | Copper | 0.500" (12.70mm) | SMD Pad | SMD | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
|
|
Advanced Thermal Solutions Inc. |
605
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-218/TO-220 BLACK
|
- | Board Level, Vertical | Aluminum | 1.772" (45.00mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.500" (12.70mm) | - | 9.00°C/W @ 200 LFM | 13.00°C/W | Black Anodized | |||
|
|
|
Ohmite |
5
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Top Mount | - | 0.500" (12.70mm) | SMD Pad | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Ohmite |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TO-268 HEAT SINK /POLY TAPE
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | ||
|
|
|
Ohmite |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TO-268 HEAT SINK /POLY TAPE
|
D | Top Mount | Aluminum | 0.500" (12.70mm) | Solderable Feet | TO-268 | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized |
