- Material：
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- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Electus conditionibus;
Odonata Lepidoptera products 90
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Quaestiones
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | - | Rectangular | 1.675" (42.55mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 1.5W @ 20°C | 3.00°C/W @ 700 LFM | 12.40°C/W | ||
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Wakefield-Vette |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK DPAK SMT TIN PLATED
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217 | Top Mount | Copper | Rectangular | 0.740" (18.80mm) | 0.600" (15.24mm) | - | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | ||
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Comair Rotron |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 9.5X22X28MM
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- | Board Level, Vertical | Copper | Rectangular, Fins | 1.100" (27.94mm) | 0.866" (22.00mm) | - | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | - | ||
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Comair Rotron |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 13.1X13.2X24MM
|
- | Board Level, Vertical | Copper | Rectangular, Fins | 0.848" (21.55mm) | 0.520" (13.21mm) | - | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 0.5W @ 20°C | 12.00°C/W @ 500 LFM | - | ||
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Comair Rotron |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.4X12.7X30MM
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- | Board Level, Vertical | Copper | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | ||
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Comair Rotron |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 19.4X25.4X11.4MM
|
- | Board Level | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | ||
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Comair Rotron |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 25.9X15X9.5MM
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- | Board Level | Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | - | SMD Pad | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | ||
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Comair Rotron |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 22.9X8X10.2MM
|
- | Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | ||
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Comair Rotron |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 26.2X12.7X9.9MM
|
- | Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | SMD Pad | TO-263 (D2Pak) | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | ||
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ASSMANN WSW Components |
Quaestiones
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular | 0.787" (20.00mm) | 0.984" (25.00mm) | - | PC Pin | TO-220 | 0.394" (10.00mm) | - | - | 35.00°C/W |
