- Series：
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- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Features：
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- Number of I/O：
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- Clock Frequency：
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- Current - Output Source/Sink：
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- Electus conditionibus;
Odonata Lepidoptera products 269
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | |
|
|
|
Renesas Electronics America Inc. |
154
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER 24B 44PLCC
|
Tube | - | Parallel | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.58x16.58) | Surface Mount | - | Open Drain | 24 | - | 2.5mA | ||
|
|
|
NXP USA Inc. |
4,000
|
III dies |
-
|
MOQ: 4000 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
Tape & Reel (TR) | - | I2C，SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | Surface Mount | POR | Push-Pull | 4 | 100kHz | 4mA | ||
|
|
|
NXP USA Inc. |
7,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
Cut Tape (CT) | - | I2C，SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | Surface Mount | POR | Push-Pull | 4 | 100kHz | 4mA | ||
|
|
|
NXP USA Inc. |
7,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
- | - | I2C，SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | Surface Mount | POR | Push-Pull | 4 | 100kHz | 4mA | ||
|
|
|
NXP USA Inc. |
5,000
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
Tape & Reel (TR) | - | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SO | Surface Mount | POR | Push-Pull | 4 | 400kHz | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
5,174
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
Cut Tape (CT) | - | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SO | Surface Mount | POR | Push-Pull | 4 | 400kHz | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
5,174
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
- | - | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SO | Surface Mount | POR | Push-Pull | 4 | 400kHz | 10mA，25mA | ||
|
|
|
Maxim Integrated |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER SPI 10B 16TQFN
|
Tape & Reel (TR) | - | SPI | 2.25 V ~ 3.6 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | - | Open Drain | 10 | - | 20mA | ||
|
|
|
Maxim Integrated |
203
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tube | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 8 | 400kHz | 25mA | ||
|
|
|
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Tape & Reel (TR) | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,357
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Cut Tape (CT) | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,357
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
- | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
Maxim Integrated |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
Tape & Reel (TR) | - | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain，Push-Pull | 8 | 400kHz | 18mA，30mA | ||
|
|
|
Maxim Integrated |
4,798
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
Cut Tape (CT) | - | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain，Push-Pull | 8 | 400kHz | 18mA，30mA | ||
|
|
|
Maxim Integrated |
4,798
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
- | - | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain，Push-Pull | 8 | 400kHz | 18mA，30mA | ||
|
|
|
Maxim Integrated |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER SPI 10B 16QSOP
|
Tape & Reel (TR) | - | SPI | 2.25 V ~ 3.6 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain | 10 | - | 20mA | ||
|
|
|
Maxim Integrated |
2,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 10B 16QSOP
|
Cut Tape (CT) | - | SPI | 2.25 V ~ 3.6 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain | 10 | - | 20mA | ||
|
|
|
Maxim Integrated |
2,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 10B 16QSOP
|
- | - | SPI | 2.25 V ~ 3.6 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain | 10 | - | 20mA | ||
|
|
|
Renesas Electronics America Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER 24B 44MQFP
|
Tray | - | Parallel | 4.5 V ~ 5.5 V | 0°C ~ 70°C | 44-QFP | 44-MQFP (10x10) | Surface Mount | - | Open Drain | 24 | - | 2.5mA | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Tape & Reel (TR) | - | I2C | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 8 | 1MHz | - |
