- Series:
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- Interface:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Mounting Type:
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- Features:
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- Number of I/O:
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- Clock Frequency:
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- Current - Output Source/Sink:
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- Electus conditionibus;
Odonata Lepidoptera products 269
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | ||
Texas Instruments |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QFN
|
Tape & Reel (TR) | - | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-VQFN (4x4) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 10mA,25mA | ||||
Texas Instruments |
1,937
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QFN
|
Cut Tape (CT) | - | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-VQFN (4x4) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 10mA,25mA | ||||
Texas Instruments |
1,937
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QFN
|
- | - | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-VQFN (4x4) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | - | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
Tape & Reel (TR) | - | I2C,SPI | 2.3 V ~ 3.6 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | - | Push-Pull | 8 | 400kHz | - | ||||
NXP USA Inc. |
1,054
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
Cut Tape (CT) | - | I2C,SPI | 2.3 V ~ 3.6 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | - | Push-Pull | 8 | 400kHz | - | ||||
NXP USA Inc. |
1,054
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
- | - | I2C,SPI | 2.3 V ~ 3.6 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | - | Push-Pull | 8 | 400kHz | - | ||||
Texas Instruments |
Quaestiones
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC GPIO EXPANDER 16DSBGA
|
Tape & Reel (TR) | - | MIPI? RFFE | 1.8 V ~ 3.3 V | -30°C ~ 85°C | 16-WFBGA,DSBGA | 16-DSBGA (2.5x2.12) | Surface Mount | POR | Open Drain | 8 | 26MHz | - | ||||
Texas Instruments |
1,783
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 16DSBGA
|
Cut Tape (CT) | - | MIPI? RFFE | 1.8 V ~ 3.3 V | -30°C ~ 85°C | 16-WFBGA,DSBGA | 16-DSBGA (2.5x2.12) | Surface Mount | POR | Open Drain | 8 | 26MHz | - | ||||
Texas Instruments |
1,783
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 16DSBGA
|
- | - | MIPI? RFFE | 1.8 V ~ 3.3 V | -30°C ~ 85°C | 16-WFBGA,DSBGA | 16-DSBGA (2.5x2.12) | Surface Mount | POR | Open Drain | 8 | 26MHz | - | ||||
Maxim Integrated |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tape & Reel (TR) | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 25mA | ||||
Maxim Integrated |
422
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Cut Tape (CT) | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 25mA | ||||
Maxim Integrated |
422
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
- | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 25mA | ||||
Maxim Integrated |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | - | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 18mA,30mA | ||||
Maxim Integrated |
772
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | - | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 18mA,30mA |