- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Electus conditionibus;
Odonata Lepidoptera products 2,862
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
183,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
165,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
171,519
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
171,519
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
95,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
238,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
156,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
Harwin Inc. |
260,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
274,269
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
274,269
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
145,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.083" (2.10mm) | 0.233" (5.92mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
154,577
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.083" (2.10mm) | 0.233" (5.92mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder |
