- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Electus conditionibus;
Odonata Lepidoptera products 2,862
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
259
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
143
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69X406.4MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | - | 12.000" (304.80mm) | 0.067" (1.70mm) | - | - | - | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Leader Tech Inc. |
600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.315" (8.00mm) | 0.354" (9.00mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
1,173
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.315" (8.00mm) | 0.354" (9.00mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
1,173
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.315" (8.00mm) | 0.354" (9.00mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | 0.157" (4.00mm) | 0.078" (2mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,044
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | 0.157" (4.00mm) | 0.078" (2mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | 0.157" (4.00mm) | 0.078" (2mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | Shield Finger | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,511
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | Shield Finger | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,511
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | Shield Finger | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | Shield Clip | Beryllium Copper | - | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | Shield Clip | Beryllium Copper | - | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder |
