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- Type：
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- Shape：
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- Height：
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- Electus conditionibus;
Odonata Lepidoptera products 2,862
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
74
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Rivet | ||
|
|
|
Laird Technologies EMI |
94
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | - | - | - | - | 15.000" (381.00mm) | 0.623" (15.82mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
71
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
770
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
770
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
350
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
350
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
464
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.197" (5.00mm) | 18.000" (457.20mm) | 0.197" (5.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
67
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 4.95X457.2MM SQ
|
- | Fabric Over Foam | - | Square | 0.197" (5.00mm) | 18.000" (457.20mm) | 0.197" (5.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
42
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 8X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.157" (4.00mm) | 18.000" (457.20mm) | 0.315" (8.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
26
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 19.1X457.2MM REC
|
- | Fabric Over Foam | - | Rectangle | 0.059" (1.50mm) | 18.000" (457.20mm) | 0.752" (19.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
97
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder |
