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- Electus conditionibus;
Odonata Lepidoptera products 2,862
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.19 AU 16--9-19UD-AU-16-
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.190" (4.83mm) | Gold | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.05 X 0.53 AU 16--4-53D-AU-16--
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.050" (1.28mm) | 16.000" (406.40mm) | 0.530" (13.46mm) | Gold | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
.500" X 50 LONG TECHMESH TAPE--
|
- | Gasket Sleeve | - | - | - | - | 0.500" (12.70mm) | Tin | - | - | |||
|
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Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU NR REC
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 AU 16--11-S-32AH-AU-
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Gold | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 BD 300"--FOLDED SERI
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 25.00 (7.62m) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.08 SN 300--TWIST RIGHT
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 25.00 (7.62m) | 0.080" (2.03mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.34 BD 300--6-34T-BD-300
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 25.00 (7.62m) | 0.340" (8.64mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOK ROD 1/2X12
|
- | - | - | - | - | - | - | - | - | - | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
2.25" X 50 LONG TECHMESH TAPE--
|
- | Gasket Sleeve | - | - | - | - | 2.250" (57.15mm) | Tin | - | - | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ELMT,MT,CUTIPLAT,RL
|
- | - | - | - | - | - | - | - | - | - | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 400--FOLDED SERIE
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 33.33 (10.16m) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
|
- | - | - | - | - | - | - | - | - | - | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
|
- | - | - | - | - | - | - | - | - | - | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 300"--FOLDED SERI
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
|
- | - | - | - | - | - | - | - | - | - | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 300"--FOLDED SERI
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 300"--FOLDED SERI
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 25.00 (7.62m) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.08 X 0.25 BD 400--FOLDED SERIE
|
-55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 33.33 (10.16m) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
|
- | - | - | - | - | - | - | - | - | - |
