- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Electus conditionibus;
Odonata Lepidoptera products 2,862
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
30,219
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.3MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.051" (1.30mm) | 0.093" (2.37mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
54,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
57,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
57,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
36,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
498,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
19,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
1,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
2,273
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 2.03X9.53MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.062" (1.57mm) | 0.375" (9.53mm) | 0.084" (2.13mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
1,969
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 4X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,162
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,168
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.118" (3.00mm) | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive |
