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- Electus conditionibus;
Odonata Lepidoptera products 2,103
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Laird Technologies EMI |
7,010
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
2,468
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 3X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.079" (2.00mm) | 18.000" (457.20mm) | 0.118" (3.00mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 6.4X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.059" (1.50mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1,208
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 6.4X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.142" (3.60mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1,831
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
OSTRSD ECE089
|
- | Fabric Over Foam | Polyurethane Foam,Nylon | Round | - | 12.000" (304.80mm) | 0.070" (1.70mm) | - | - | - | ||||
Laird Technologies EMI |
727
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 12.7X457.2MM REC
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.252" (6.40mm) | 18.000" (457.20mm) | 0.500" (12.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
243
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 12.7X457.2MM DSHP
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.374" (9.50mm) | 18.000" (457.20mm) | 0.500" (12.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
850
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FAB/FOAM 12.7X457.2MM BELL
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Bell | 0.142" (3.60mm) | 18.000" (457.20mm) | 0.500" (12.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
581
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 12.7X457.2MM SQ
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Square | 0.500" (12.70mm) | 18.000" (457.20mm) | 0.500" (12.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
6,260
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 15X457.2MM SQ
|
- | - | - | Square | - | 18.000" (457.20mm) | 0.591" (15.00mm) | - | - | - | ||||
Laird Technologies EMI |
818
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 8X457.2MM CFOLD
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | C-Fold | 0.315" (8.00mm) | 18.000" (457.20mm) | 0.315" (8.00mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
102
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB 24X24
|
ECCOSORB | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | - | ||||
Laird Technologies EMI |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB AN-73 24X24
|
ECCOSORB | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | - | ||||
Laird Technologies EMI |
308
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB 24X24
|
ECCOSORB | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | - | ||||
Laird Technologies EMI |
136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB 24X24
|
ECCOSORB | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | - | ||||
Laird Technologies EMI |
102
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ECCOSORB 24X24
|
ECCOSORB | Absorbing Sheet | Polyurethane Foam | Sheet | - | 24.016" (610.00mm) | 24.016" (610.00mm) | - | - | - | ||||
Molex,LLC |
64,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | Shield Finger,Pre-Loaded | Stainless Steel | - | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
Molex,LLC |
72,070
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | Shield Finger,Pre-Loaded | Stainless Steel | - | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
Molex,LLC |
72,070
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | Shield Finger,Pre-Loaded | Stainless Steel | - | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder |