Height:
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Odonata Lepidoptera products 2,103
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Type Material Shape Height Length Width Plating Plating - Thickness Attachment Method
120220-0314
ITT Cannon,LLC
40,874
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 3.5MM
- Shield Finger,Pre-Loaded Titanium Copper - 0.138" (3.50mm) 0.149" (3.79mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0312
ITT Cannon,LLC
498,400
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 2.5MM
- Shield Finger,Pre-Loaded Titanium Copper - 0.098" (2.50mm) 0.144" (3.66mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0312
ITT Cannon,LLC
499,117
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 2.5MM
- Shield Finger,Pre-Loaded Titanium Copper - 0.098" (2.50mm) 0.144" (3.66mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0312
ITT Cannon,LLC
499,117
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 2.5MM
- Shield Finger,Pre-Loaded Titanium Copper - 0.098" (2.50mm) 0.144" (3.66mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0315
ITT Cannon,LLC
19,200
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 4.0MM
- Shield Finger,Pre-Loaded Titanium Copper - 0.157" (4.00mm) 0.157" (3.99mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0315
ITT Cannon,LLC
20,553
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 4.0MM
- Shield Finger,Pre-Loaded Titanium Copper - 0.157" (4.00mm) 0.157" (3.99mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
120220-0315
ITT Cannon,LLC
20,553
III dies
-
MOQ: 1  MPQ: 1
MICRO UNIVERSAL CONTACT Z 4.0MM
- Shield Finger,Pre-Loaded Titanium Copper - 0.157" (4.00mm) 0.157" (3.99mm) 0.038" (0.96mm) Nickel 118.11μin (3.00μm) Solder
S1951-46R
Harwin Inc.
4,900
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Shield Finger Beryllium Copper - 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1951-46R
Harwin Inc.
5,200
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Shield Finger Beryllium Copper - 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1951-46R
Harwin Inc.
5,200
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER TIN SMD
EZ BoardWare Shield Finger Beryllium Copper - 0.285" (7.25mm) 0.378" (9.59mm) 0.224" (5.70mm) Tin 118.11μin (3.00μm) Solder
S1941-42R
Harwin Inc.
1,750
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER GOLD SMD
- Shield Finger - - 0.285" (7.25mm) 0.378" (9.60mm) 0.225" (5.70mm) Gold Flash Solder
S1941-42R
Harwin Inc.
2,087
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER GOLD SMD
- Shield Finger - - 0.285" (7.25mm) 0.378" (9.60mm) 0.225" (5.70mm) Gold Flash Solder
S1941-42R
Harwin Inc.
2,087
III dies
-
MOQ: 1  MPQ: 1
RFI SHIELD FINGER GOLD SMD
- Shield Finger - - 0.285" (7.25mm) 0.378" (9.60mm) 0.225" (5.70mm) Gold Flash Solder
4223PA51H01800
Laird Technologies EMI
1,969
III dies
-
MOQ: 1  MPQ: 1
GASKT FABRIC/FOAM 4X457.2MM RECT
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.039" (1.00mm) 18.000" (457.20mm) 0.157" (4.00mm) - - Adhesive
4584PA51H01800
Laird Technologies EMI
1,162
III dies
-
MOQ: 1  MPQ: 1
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.039" (1.00mm) 18.000" (457.20mm) 0.150" (3.80mm) - - Adhesive
4742PA51H01800
Laird Technologies EMI
1,168
III dies
-
MOQ: 1  MPQ: 1
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.118" (3.00mm) 18.000" (457.20mm) 0.150" (3.80mm) - - Adhesive
4046PA51H01800
Laird Technologies EMI
1,111
III dies
-
MOQ: 1  MPQ: 1
GASKET FABRIC/FOAM 3X457.2MM SQ
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.118" (3.00mm) 18.000" (457.20mm) 0.118" (3.00mm) - - Adhesive
4094PA51H01800
Laird Technologies EMI
1,073
III dies
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 4.1X457.2MM RECT
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.079" (2.00mm) 18.000" (457.20mm) 0.161" (4.10mm) - - Adhesive
4186PA51H01800
Laird Technologies EMI
711
III dies
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 5.1X457.2MM RECT
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.079" (2.00mm) 18.000" (457.20mm) 0.201" (5.10mm) - - Adhesive
4056PA51H01800
Laird Technologies EMI
474
III dies
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 5.1X457.2MM RECT
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.059" (1.50mm) 18.000" (457.20mm) 0.201" (5.10mm) - - Adhesive