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- Type:
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- Material:
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- Shape:
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- Electus conditionibus;
Odonata Lepidoptera products 2,103
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
ITT Cannon,LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
498,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
19,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | - | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | - | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
ITT Cannon,LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | Shield Finger,Pre-Loaded | Titanium Copper | - | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
4,900
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
1,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||||
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||||
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||||
Laird Technologies EMI |
1,969
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 4X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1,162
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1,168
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.118" (3.00mm) | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 3X457.2MM SQ
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.118" (3.00mm) | 18.000" (457.20mm) | 0.118" (3.00mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1,073
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 4.1X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.079" (2.00mm) | 18.000" (457.20mm) | 0.161" (4.10mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
711
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.079" (2.00mm) | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
474
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.059" (1.50mm) | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive |