- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Plating：
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- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
183,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
167,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI CLIP 1900/TR (T&R)
|
EZ BoardWare | -40°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
172,856
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI CLIP 1900/TR (T&R)
|
EZ BoardWare | -40°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
172,856
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI CLIP 1900/TR (T&R)
|
EZ BoardWare | -40°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
165,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
- | -25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
171,519
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
- | -25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
171,519
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
- | -25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
90,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
90,634
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
90,634
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
ITT Cannon，LLC |
95,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
238,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
156,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder |
