- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
157
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 3.18X304.8MM
|
- | - | - | - | - | - | 12.000" (304.80mm) | 0.125" (3.18mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU ALLOY 6X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
159
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
218
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4.6X406.4MM
|
- | - | - | - | - | - | 16.000" (406.40mm) | 0.181" (4.60mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
156
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | - | - | 12.000" (304.80mm) | 0.063" (1.60mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
328
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.11X406.4MM
|
- | - | - | - | - | - | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
491
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
102
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.40MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
221
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | - | - | 12.000" (304.80mm) | 0.067" (1.70mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
483
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 6.35X406.4MM
|
- | - | - | - | - | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
151
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 10MMX2.44M RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 0.016" (0.40mm) | 96.000" (243.84cm) | 0.394" (10.00mm) | - | - | - | ||
|
|
|
Harwin Inc. |
20,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
22,663
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
22,663
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Molex Connector Corporation |
9,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | Solder | ||
|
|
|
Molex Connector Corporation |
9,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | Solder | ||
|
|
|
Molex Connector Corporation |
9,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | Solder | ||
|
|
|
Harwin Inc. |
30,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Flash | Solder |
