- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
12,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
13,779
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
13,779
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
4,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | 0.118" (3.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
5,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | 0.118" (3.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
5,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | 0.118" (3.00mm) | - | - | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
3,537
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
3,537
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
3,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,381
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,381
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
11,004
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
11,004
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | - | - |
