- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.23MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.048" (1.23mm) | 0.102" (2.60mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
22,479
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.23MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.048" (1.23mm) | 0.102" (2.60mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
22,479
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.23MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.048" (1.23mm) | 0.102" (2.60mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,207
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,207
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.098" (2.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.098" (2.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.098" (2.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
ITT Cannon，LLC |
54,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
57,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
57,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
36,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
7,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.079" (2.00mm) | 0.138" (3.50mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,467
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.079" (2.00mm) | 0.138" (3.50mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,467
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.079" (2.00mm) | 0.138" (3.50mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder |
