- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
7,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMI SHIELD FINGER T&R(2000/R)
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Tin | 98.43μin (2.50μm) | Solder | ||
|
|
|
Harwin Inc. |
11,509
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMI SHIELD FINGER T&R(2000/R)
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Tin | 98.43μin (2.50μm) | Solder | ||
|
|
|
Harwin Inc. |
16,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
16,136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
16,136
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
9,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 5.5MM HIGH TIN
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Tin | 94.49μin (2.40μm) | Solder | ||
|
|
|
Harwin Inc. |
10,340
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 5.5MM HIGH TIN
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Tin | 94.49μin (2.40μm) | Solder | ||
|
|
|
Harwin Inc. |
10,340
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 5.5MM HIGH TIN
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Tin | 94.49μin (2.40μm) | Solder | ||
|
|
|
Harwin Inc. |
4,900
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
1,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | - | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | - | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | - | Shield Finger | - | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
25,564
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X4.27MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | - | - | Slot |
