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- Operating Temperature：
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- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
2,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
2,273
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 2.03X9.53MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.062" (1.57mm) | 0.375" (9.53mm) | 0.084" (2.13mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
1,969
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 4X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,162
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,168
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.118" (3.00mm) | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 3X457.2MM SQ
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.118" (3.00mm) | 18.000" (457.20mm) | 0.118" (3.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,073
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 4.1X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.079" (2.00mm) | 18.000" (457.20mm) | 0.161" (4.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
711
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.079" (2.00mm) | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
474
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.059" (1.50mm) | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 4X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.020" (0.50mm) | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,126
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 2.3X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.051" (1.30mm) | 18.000" (457.20mm) | 0.091" (2.30mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 6.4X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.118" (3.00mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
839
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 7X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | 0.276" (7.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
6,176
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 6.4X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.126" (3.20mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,461
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 6.4X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.169" (4.30mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | - | - | Adhesive |
