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- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
5,794
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X9.04MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
3,533
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.1X9.88MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.128" (3.25mm) | 0.389" (9.88mm) | 0.358" (9.09mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
3,211
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X13.82MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.543" (13.79mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
1,328
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X18.4MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.725" (18.42mm) | 0.370" (9.40mm) | - | - | Slot | ||
|
|
|
Wurth Electronics Inc. |
542
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.020" (0.50mm) | 39.370" (1.00m) | 0.197" (5.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 0.091" (2.30mm) | 39.370" (1.00m) | 0.150" (3.80mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
159
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.079" (2.00mm) | 39.370" (1.00m) | 0.394" (10.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
1,437
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 3.05X9.53MM
|
- | - | - | - | - | - | 0.375" (9.53mm) | 0.120" (3.05mm) | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
107
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.118" (3.00mm) | 39.370" (1.00m) | 0.315" (8.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
115
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.157" (4.00mm) | 39.370" (1.00m) | 0.394" (10.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
123
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | - | 39.370" (1.00m) | 0.079" (2.00mm) | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
260
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.118" (3.00mm) | 39.370" (1.00m) | 0.354" (9.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.276" (7.00mm) | 39.370" (1.00m) | 0.394" (10.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
101
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.26X406.4MM
|
Dual Slot | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.325" (8.26mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
1,700
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.210" (5.33mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | - | Clip | ||
|
|
|
Wurth Electronics Inc. |
102
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.079" (2.00mm) | 39.370" (1.00m) | 0.512" (13.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Leader Tech Inc. |
116
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FSG，.060"H X .125"W X 48"L
|
- | - | Fabric Over Foam | - | D-Shape | 0.060" (1.52mm) | 48.000" (121.90cm) | 0.125" (3.18mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
220
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FSG，.015"H X .200"W X 48"L
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.015" (0.38mm) | 48.000" (121.92cm) | 0.200" (5.08mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
541
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTCK BECU ALY 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
3,784
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.1X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Slot |
