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- Electus conditionibus;
Odonata Lepidoptera products 3,471
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
134
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
192
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
184
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.297" (7.54mm) | - | - | Clip | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.059" (1.50mm) | 39.370" (1.00m) | 0.984" (25.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.118" (3.00mm) | 39.370" (1.00m) | 0.906" (23.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
1,428
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | - | - | 12.000" (304.80mm) | 0.063" (1.60mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
104
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.4X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.350" (8.89mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | - | - | Clip | ||
|
|
|
Leader Tech Inc. |
139
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FSG，.25"H X .375"W X 48"L
|
- | - | Fabric Over Foam | - | D-Shape | 0.250" (6.35mm) | 48.000" (121.90cm) | 0.375" (9.52mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
405
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
259
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
143
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
106
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 19.3X609.6MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
162
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | - | - | 12.000" (304.80mm) | 0.067" (1.70mm) | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
135
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | - | 39.370" (1.00m) | 0.472" (12.00mm) | - | - | - | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex Connector Corporation |
6,551
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex Connector Corporation |
6,551
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder |
