- Series：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Shape：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Electus conditionibus;
Odonata Lepidoptera products 3,471
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Molex，LLC |
6,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
1,817
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
1,817
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
6,720
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
6,720
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.098" (2.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.098" (2.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.098" (2.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.079" (2.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,275
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.079" (2.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,275
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.079" (2.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder |
